| The impact of innerlayer copper foil roughness on signal integrity: smooth copper minimizes signal attenuation at high frequencies but it can negatively ... from: Printed Circuit Design & Manufacture |  | Author: Bruce Lee
Publisher: Thomson Gale
Category: Book
Buy New: $9.95
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Format: HTML
Media: Digital
Pages: 8
ASIN: B000R4YUXC
Publication Date: May 1, 2007
Availability: Available for download now
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Product Description
This digital document is an article from Printed Circuit Design & Manufacture, published by Thomson Gale on May 1, 2007. The length of the article is 2106 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available in your Amazon.com Digital Locker immediately after purchase. You can view it with any web browser.
Citation Details
Title: The impact of innerlayer copper foil roughness on signal integrity: smooth copper minimizes signal attenuation at high frequencies but it can negatively impact product reliability by reducing innerlayer bond strength.(INNERLAYER COPPER CONSIDERATIONS)
Author: Bruce Lee
Publication: Printed Circuit Design & Manufacture (Magazine/Journal)
Date: May 1, 2007
Publisher: Thomson Gale
Volume: 24 Issue: 5 Page: 27(3)
Distributed by Thomson Gale
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